CUSTOMIZED
Substrate material: UVFS
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 3.0 mm +/-0.1 mm
Clear aperture: >90%
Surface quality, S1/S2: 20-10 S-D over CA as per MIL-PRF-13830B
Surface flatness, S1/S2: <λ/8@633 nm over 9 mm CA
Parallelism: <3 arcmin
Protective chamfer: 0.2-0.4 x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HT>99.5% @ 532 nm, AOI=0 deg
S2: AR<1% 532 nm & HR>99.5% @ 650+585 nm, AOI=0 deg
LIDT: >15J/cm^2@532nm, 7ns, 10Hz best effort
