CUSTOMIZED
Substrate material: UVFS (Corning 7980 0F)
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 5.0 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 10-5 S-D as per MIL-PRF-13830B
Surface flatness, S1/S2: <λ/8 @ 633 nm over CA
Parallelism: <5 arcmin
Protective chamfer: 0.1 - 0.3 mm x 45°
Chips: <0.1 mm stoned
Coatings (IBS, S1 T understood as S1+S2 performance):
S1 (arrow marks): HRs>99% @ 410 - 540 nm + HTp>95% @ 760 - 1000 nm + 1100 - 2600 nm + HTs>75% @ 1100 - 2600 nm, AOI=60 deg
Low GDD Rs <30 fs² @ 410 - 540 nm, AOI=60 deg
S2: ARs @ 1100 - 2600 nm + ARp @ 760 - 2600 nm, AOI=60 deg
