CUSTOMIZED
Substrate material: UVFS
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1: 20-10 S-D per CA as per MIL
Surface quality, S2: polished
Surface flatness, S1: <λ/4 @ 633 nm per 17 mm dia
Parallelism: <5 arcmin
Protective chamfer: 0.2-0.4 mm x 45 deg
Chips: <0.2 mm stoned
Coatings (IBS):
S1: HRa>99.9% @ 1064 nm, AOI=40 - 50 deg
S2: Uncoated
