CUSTOMIZED
Substrate Material: UVFS
Diameter: 25.4 mm +0/-0.1 mm
Edge Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 20-10 S-D per CA (following MIL-PRF-13830B standard)
Surface flatness, S1: <λ/4 @633 nm over 15 mm dia. CA
Parallelism: < 30 arcsec
Protective chamfer: 0.2-0.5 mm x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HRa>99% @ 2940 nm + 1535 nm + Ta>85% @ 635 nm, AOI 45 deg.
S2: uncoated
