CUSTOMIZED
Substrate Material: UVFS
Diameter: 25.4 mm +0/-0.1 mm
Edge Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1: 20-10 S-D per CA
Surface quality, S2: fine grinded
Surface flatness, S1: λ/4@633 nm over 12-13mm dia. CA
Parallelism: < 5 arcmin
Protective chamfer: 0.2-0.4 mm x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HRa> 99% @ 2940 nm + HRa > 98% @ 1064 nm + HRa >94% 532 nm + HRa > 95% @ 633 nm, AOI 45 deg.
S2 (fine grinded): Uncoated
