CUSTOMIZED
Substrate material: Silicon (suitable for ~3 μm laser applications)
Diameter: 12.7 mm +0/-0.1 mm
Thickness: 6.0 mm +/-0.1 mm
Clear aperture: min 10 mm
Surface quality, S1/S2: 40-20 S-D over CA as per MIL-PRF-13830B
Surface form error, S1: λ/4 @ 633 nm
Parallelism: < 0.03 mm
Protective chamfers, S1/S2: 0.1-0.3 mm x 45deg
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): PR = 75% +/-1% @ 2940 nm, AOI 0 deg.
S2: AR<0.25% @ 2940 nm, AOI 0 deg
