CUSTOMIZED
Substrate Material: UVFS
Diameter: 12.7 mm +0/-0.1 mm
Edge Thickness: 3 mm +/-0.1 mm
Clear aperture: min 11 mm
Surface quality, S1/S2: 20-10 S-D per CA
Surface flatness, S1: λ/8@633 nm over 9 mm dia. CA
Parallelism: < 10 arcsec
Protective chamfer: 0.1-0.2 mm x 45°
Chips: <0.1 mm stoned
Coatings (IBS):
S1 (arrow marks): HTp > 99.6% @ 1064nm + HRs > 99.9% @ 532 nm, AOI 0 deg.
S2: ARp < 0.1% @ 1064 nm, AOI 0 deg
