CUSTOMIZED
Substrate material: UVFS
Diameter: 12.7 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 10 mm
Surface quality, S1/S2: 10-5 S-D per CA (MIL-PRF-13830B)
Surface flatness, S1: <λ/8@633 nm over 6 mm CA
Parallelism: < 5 arcmin
Protective chamfer: 0.2-0.3 x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HRp > 97.5% (best effort >98.5%) @ 266 nm + Rp<2%; Rs<10% @ 532 nm + Rp<2%; Rs<10% @ 1064 nm, AOI 45 deg.
S2: Uncoated
