CUSTOMIZED
Substrate Material: UVFS (Corning 7980 0F)
Diameter: 12.7 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 m
Clear aperture: min 10,16 mm
Surface quality, S1: 10-5 S-D per CA
Surface quality, S2: commercial polish
Surface flatness, S1: <λ/8 @ 633 nm over CA
Parallelism: < 10 arcsec
Protective chamfers: 0.1-0.4 mm x 45 deg.
Chips: < 0.2 mm
Coating (IBS)
S1(arrow mark): Rs_avg>99.95% @ Rp_avg>99.9% @ 1000-1060 nm, |GDD Rs, Rp|<20 fs2 @ 1000-1060 nm, AOI 45 deg
S2: uncoated
