CUSTOMIZED
Substrate material: UVFS (Corning 7980)
Diameter: 25.0 mm +0/-0.1 mm
Edge thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 20-10 S-D per CA (following MIL-PRF-13830B standard)
Surface flatness, S1/S2: <λ/4 @633 nm over any 15 mm aperture within CA
Parallelism: < 30 arcsec
Protective chamfer: 0.2-0.5 mm x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HRa>99% @ 2940 nm + HTa>98% @ 1540 nm + Ra = 50% +/- 20% @ 589-594 m + 532 nm, AOI 45 deg
S2: ARa< 0.7% @ 1540 nm, AOI 45 deg
