CUSTOMIZED
Substrate material: UVFS
Diameter: 25.0mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: >85%
Surface quality, S1: 20-10 S-D over CA as per MIL-PRF-13830B
Surface quality, S2: polished
Surface flatness, S1: <λ/8@633 nm per CA = 20 mm and L/10 best effort.
Parallelism: <10 arcsec
Protective chamfers: 0.2-0.4 mm x 45°
Chips: <0.2 mm
Coatings (IBS):
S1 (arrow marks): HRs,p>99.9% @1064 nm + HRs,p>99.8% @ 532 nm + HRs,p>99.5% @ 355 nm, AOI=45 deg
S2: SCC
