CUSTOMIZED
Substrate Material: UVFS
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 3.0 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 20-10 S-D per CA
Surface flatness, S1: <λ/4@633 nm over CA
Parallelism: <5 arcmin
Protective chamfer: 0.2-0.3 mm x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 + S2 performance: Tа=Rа=50% +/0.5% @ 1064 nm, AOI 6 deg.
