Substrate Material: UVFS (Corning 7980 0F)
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 3.0 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 20-10 S-D over CA (as per MIL-PRF-13830B)
Surface flatness, S1: PV λ/8 @633 nm over 10 mm CA
Parallelism: <1 arcmin
Protective chamfers: 0.2-0.4 mm x 45 deg
Chips: <0.2 mm
Coatings (IBS):
S1 (arrow marks): HRsp_avg>99.9% @ 950-980 nm + Rs_avg < 3.5% + Rp_avg< 3%@ 1020-1100 nm, AOI=22.5 +/-3 deg*
S2: ARsp<0.25% @ 1020-1100 nm, AOI=22.5 deg
* specifications will be achieved by ±3deg angle adjustment
