CUSTOMIZED
Substrate material: UVFS (Corning 7980 0F)
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 5.0 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 20-10 S-D per CA
Surface flatness, S1/S2: <λ/4 @633 nm per CA
Parallelism: <1 arcmin
Protective chamfer: 0.1 - 0.25 mm x 45°
Chips: <0.3 mm stoned
Coatings (IBS):
S1 (arrow marks): Rs=99.0% +/-0.1% @ 1020 nm - 1070 nm, AOI=45 deg
Low GDD Rs @ 1020 - 1070 nm, AOI=45 deg
S2: Uncoated
LIDT: >0.05 J/cm2, 1030 nm, 500 fs, 1 kHz (S-on-1, S=1000, 200 um)
