CUSTOMIZED
Substrate Material: UVFS
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: >85%
Surface quality, S1: 20-10 S-D per CA as per MIL-PRF-13830B
Surface quality, S2: polished
Surface flatness, S1: <λ/5@633 nm per CA
Surface flatness, S2: NA
Parallelism: <10 arcsec
Protective chamfer: 0.2-0.4 x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HRs>95% & HRp>90% @ 196-200 nm, AOI=45 deg
S2: Uncoated
