CUSTOMIZED
Substrate material: UVFS
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 10-5 S-D per CA (MIL-PRF-13830B)
Surface flatness, S1: <λ/8@633 nm over X mm CA
Parallelism: < 5 arcmin
Protective chamfer: 0.1-0.4 mm x 45 deg
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HRs > 99.5% @ 266 nm + Rp<2%; Rs<10% @ 532 nm + Rp<2%; Rs<10% @ 1064 nm, AOI 45 deg.
S2: Uncoated
LIDT and lifetime enhanced design (ns pulse applications)
