CUSTOMIZED
Substrate material: UVFS (Corning 7980 0F)
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 10-5 S-D per CA (MIL-PRF-13830B)
Surface flatness, S1/S2: PV <λ/6@633 nm per Dia12.7 mm
Parallelism: <1 arcmin
Protective chamfers: 0.2-0.4 mm x 45 deg
Chips: <0.2 mm
Coatings (IBS):
S1 (arrow marks): HRsp_avg>99.85% @ 1020 - 1040 nm + HTu>95% 970 - 980 nm, AOI=0-10 deg
S2: ARu<0.1% @ 970 – 980 nm, AOI=0-10 deg
LIDT: optimized for ps application.
