CUSTOMIZED
Substrate material: UVFS (Corning 7980 0F)
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 20-10 S-D MIL-PRF-13830B
Surface flatness, S1/S2: <λ/8 @633 nm over Dia15 mm
Parallelism: <10 arcsec
Protective chamfer: 0.2-0.4 mm x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HRs>99.5% @ 355 nm + HTp>98% @ 532 nm + HTs>98% @ 1064 nm, AOI=45 deg
S2: ARp<0.5% @ 532 nm + ARs<0.5% @ 1064 nm, AOI=45 deg
LIDT: Lifetime optimized design
