Substrate Material: UVFS (Corning 7980 0F)
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 23 mm
Surface quality, S1/S2: 20-10 S-D per CA (MIL-PRF-13830B)
Surface flatness, S1/S2: PV <λ/4@633 nm per CA (converts to λ/3 reflected wavefront error) per CA
Parallelism: <5 arcmin
Protective chamfers: 0.1-0.4 mm x 45 deg
Chips: <0.2 mm
Coatings (IBS):
S1 (arrow marks): Rs>99.9% @ 1030 nm + Tp>98% (>99% best efforts) @ 1030 nm, AOI=45 deg +/-1 deg
S2: SCC + ARp<0.1% @ 1030 nm, AOI=45 deg +/-1 deg
LIDT optimized for 5mJ, 200kHz, 500fs.
