CUSTOMIZED
Substrate material: UVFS
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: min 20 mm
Surface quality, S1/S2: 20-10 S-D per CA (MIL-PRF-13830B)
Surface flatness, S1: PV <λ/4@633 nm per CA
Parallelism: <30 arcsec
Protective chamfers: 0.1-0.4 mm x 45 deg
Chips: <0.2 mm
Coatings (IBS):
S1 (arrow marks): Rs>99.9% @ 1030 nm + Tp>98% (>99% best efforts) @ 1030 nm, AOI=45 deg +/-0 deg
S2: SCC + ARp<0.1% @ 1030 nm, AOI=45 deg
LIDT: optimised for 1030 nm, 300 fs, 100 uJ, 100 kHz, 2 mm beam diameter
