CUSTOMIZED
Substrate Material: UVFS (Corning 7980 0F)
Diameter: 25.4 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: >80%
Surface quality, S1: 10-5 S-D per CA (as per MIL)
Surface quality, S2: commercial polish
Surface flatness, S1: <λ/10@ 633 nm over CA
Parallelism: < 10 arcsec
Protective chamfers: 0.1-0.4 mm x 45 deg.
Chips: < 0.2 mm
Coating (IBS)
S1(arrow marks): HRavg > 99.7% @ 730-870 nm,
HRs > 99.7% @ 685-935 nm, AOI 45 deg
GDD: 0 ±20 fs2 @ 700 - 900 nm, s-pol & 0 ±20 fs2 @ 740 - 860 nm, p-pol
TOD: 10 fs3 @ 800 nm, s-pol & 40 fs3 @ 800 nm, p-pol
S2: SCC
