CUSTOMIZED
Substrate material: UVFS (Corning 7980)
Diameter: 50.8 mm (+0/-0.1 mm)
Thickness: 12.7 mm (+/-0.1 mm)
Clear aperture: 45 mm
Surface quality, S1/S2: 20-10 S-D per CA (as per MIL-PRF-13830B)
Surface flatness, S1: λ/5 @ 633 nm over CA (substrates: λ/10)
Parallelism error: < 30 arcsec
Protective chamfers: 0.2-0.6 mm x 45 deg
Chips: < 0.2 mm stoned
Laser marked arrow S1.
S1 (arrow marks): HRsp>99.7% @ 355 nm, AOI=44 - 46 deg
S2: ARsp < 0.8% @ 355nm, AOI= 44 - 46 deg
LIDT: > 10 J/cm2 @ 355 nm, 6 ns, 100 Hz (best effort)
