CUSTOMIZED
Substrate material: UVFS
Diameter: 50.8 mm +0/-0.1 mm
Thickness: 9.52 mm +/-0.1 mm
Clear aperture: min 40.64
Surface quality, S1: 10-5 S-D per CA
Surface quality, S2: commercial polish
Surface flatness, S1: λ/8 or better @ 633 nm over CA
Parallelism: < 10 arcsec
Protective chamfers: 0.1-0.4 mm x 45 deg.
Chips: < 0.2 mm
Coating (IBS):
S1: Rs_avg>99.95% @ Rp_avg>99.9% @ 1000-1060 nm, |GDD Rs, Rp|<20 fs2 @ 1000-1060 nm
S2: SCC
AOI 45 deg
