CUSTOMIZED
Substrate material: Fused Silica
Diameter: 76.2 mm +0/-0.1 mm
Thickness: 12.7 mm +/-0.1 mm
Clear aperture: min 64 mm
Surface quality, S1/S2: 40-20 S-D per CA
Surface flatness, S1: λ/8 - λ/10 @633 nm over any 30 mm aperture within CA.
Parallelism: < 5 arcmin
Protective chamfer: 0.2-0.6 mm x 45°
Chips: <0.2 mm stoned
Coatings (IBS):
S1 (arrow marks): HRa > 97% @ 790 nm + HTa > 80%@ 808 nm + HTa > 97%@ 1070 nm, AOI 45 deg.
S2: ARa< 1% @ 790-1070 nm, AOI 45 deg.
