CUSTOMIZED
Substrate Material: UVFS (Corning 7980 0F)
Diameter: 12.7 mm +0/-0.1 mm
Thickness: 6.35 mm +/-0.1 mm
Clear aperture: >80%
Surface quality, S1: 10-5 S-D per CA
Surface quality, S2: commercial polish
Surface flatness, S1: <λ/10@ 633 nm CA
Parallelism: < 10 arcsec
Protective chamfers: 0.1-0.4 mm x 45 deg.
Chips: < 0.2 mm
Coating (IBS)
S1: HRavg > 99.7% @ 730-870 nm, AOI 45 deg, HRs > 99.7% @ 685-935 nm, AOI 45 deg.
GDD: 0 ±20fs2 @ 700 - 900nm, s-pol
0 ± 20fs2 @ 740 - 860nm, p-pol
TOD: 10fs3 @ 800nm, s-pol
40fs3 @ 800nm, p-pol
S2: SCC
